Senior Manufacturing & Process Development Engineer (m/w/d)

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Overview

Main Objective of the Position:

TE Connectivity's Manufacturing Engineering Teams in our Global Wafer Fab Operations facilities are process leaders for Lithography, Etching, Deposition, Diffusion, Wafer Bond, Test, Dicing and other semiconductor related topics, ensuring the processes are running at optimum levels for quality and output. They are experts in wafer processing techniques, possessing extensive knowledge of the associated manufacturing processes which may include the optimization and standardization within the manufacturing environment.

Manufacturing Engineering Teams enable the TE business unit plants to reach TE Operating Advantage (TEOA) requirements, roll out Centers of Excellence (COE), Best Demonstrated Practices (BDP’s) and advise plants on tool and machine duplications / corrections / improvements. They design and develop manufacturing process and automation platforms and apply them for the realization of new product developments as well as optimization of existing products already in production. The Teams also support Product Development in the selection and optimization of tools for production and the selection of the most suitable manufacturing concepts relative to planned manufacturing quantities, quality requirements and manufacturing location. They act as interface between R&D engineering and production to ensure manufacturability of new designs and smooth production ramp up as well as identifying critical equipment upgrades and assessing new production tools.

Summary of Key Tasks/Responsibilities:

• Independently lead comprehensive activities (with high complexity and importance for the economic development of the site) focusing on product stability improvement (yield), process window analysis, and DOE including documentation in terms of change management (PCRB).
• Continuously monitor project risks considering applicable standards and existing tools, initiate countermeasures, and support the department's development.
• Responsible for yield improvement in terms of continuous improvement process (CIP).
• Technological support in transferring product innovations from development to production.
• Lead complex projects and project groups, e.g., in transferring product change developments to production, considering project timelines, documentation, and collaboration with process technology.
• Plan and evaluate experiments in collaboration with process engineers to implement sustainable improvements.

What your background should look like:

• Completed university education in physics, process engineering, electrical engineering, or similar.
• At least 5 years of practical relevant professional experience in sensor technology or semiconductor environment.
• MEMS pressure, temperature, optical sensor process Integration, process development, & unit process develoment experience in a commercial high volume MEMS wafer Fab.
• Semiconductor process integration & process engineering sustaining, project, process development, & process transfer experience in a commercial high-volume Wafer fab.
• Data mining, analyses, report-generation using tools such as Jmp/Excel/Tableau.
• Track record of leading successful complex problem solving activities using methodologies such as 8D, KT, & Model-Based problem solving.
• Experience using failure analyses & material analyses techniques to problem-solve in a commercial Wafer Fab evironment.
• Experience interacting with external Wafer foundries for process transfer & sustaining activities.
• Expert in using SPC, Lean Six Sigma, statistical methods, and project management (tools) in a commercial Wafer Fab environment.
• Demonstrated ability leading FMEA, & designing/analysing/implementing DOE activities in a commercial high-volume Wafer fab.
• Semiconductor Process and Device Simulation experience using Silvaco TCAD tools.
• Demonstrated track record of mentoring & developing junior Wafer Fab Process Integration & Process Engineers.
• Very good English skills, both written and spoken.
• Proven experience in managing /delivering projects in a commercial Wafer Fab environment.
• Teamwork, excellent communication skills.
• Demonstrated ability to report-out to cross-functional & corporate stakeholders on technical & project activites.
• Analytical and problem-oriented thinking and acting, economic thinking, high degree of independence and initiative, result orientation, structured work.

Competencies

Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

ABOUT TE CONNECTIVITY
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter).

WHAT TE CONNECTIVITY OFFERS:
We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority!

• Competitive Salary Package
• Performance-Based Bonus Plans
• Health and Wellness Incentives
• Employee Stock Purchase Program
• Community Outreach Programs / Charity Events
• Employee Resource Group

Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.